Enhancement of the optical properties of silicon devices through strain engineering
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- The trend towards miniaturization of electronic devices requires to evaluate the change of physical properties of materials at nanoscale. The present work aims at developing an on-chip laboratory devoted to put a silicon thin film specimen under biaxial loading, and to investigate the change of its materials properties. Finite elements simulations are used to derive convenient specimen designs, and to extract a set of dimensions allowing to sweep a range of strains from 0.001 to 0.04. Labs on-chip are then fabricated in cleanroom, using SOI technology.